Custom Server Heat Sink Manufacturing for High-Power Computing
Custom cooling hardware for AI, HPC, and high-density server platforms operating within demanding 1U, 2U, and 4U rack environments.
HeatsinkMaker supports your project from thermal concept and DFM review through functional prototyping, validation, and volume production.
50
CNC machining centers
200K
Aluminum heat sinks monthly
30K
Liquid cold plates monthly
10+ bar
Liquid cooling leakage testing
Built for demanding thermal loads
Air-cooled and direct-to-chip solutions
Thermal engineering
Cooling engineered around your server architecture
Modern CPUs, GPUs, and AI accelerators create concentrated heat loads inside restricted chassis layouts. Our engineers balance surface area, thermal transfer, pressure drop, weight, and manufacturability for the complete server environment.
Fin density and geometry
Skiving and zipper fin technologies create high fin-to-gap ratios for airflow-constrained server boards.
Heat spreading
Copper heat pipes and vapor chambers can be integrated into aluminum bases to reduce localized hotspots.
Material selection
Select AL1060, AL6063, or C1100 copper according to thermal conductivity, weight, and system constraints.
DFM review
Our team reviews 2D and 3D drawings before production to identify cost-saving machining and assembly improvements.
Manufacturing technologies
The right process for your thermal profile and volume
We combine specialized processes rather than forcing every server project into a single manufacturing route.
Skived Fin Heat Sinks
1U / 2UThin fins down to 0.2 mm can be formed directly from a solid copper or aluminum block. This direct thermal path avoids the additional resistance associated with bonded or soldered alternatives.
Heat Pipe and Zipper Fin Assemblies
High-power CPUCNC-machined copper bases, soldered heat pipes, and stamped zipper fins transport heat to a larger cooling area where airflow is more consistent.
Liquid Cold Plates
400W–500W+Vacuum-brazed or friction-stir-welded cold plates support direct-to-chip cooling for AI hardware beyond the practical limits of air cooling.
Technical reference
Specifications aligned with server-grade requirements
Compare air-cooled heat sinks and liquid cold plates across materials, fin structures, processing methods, finishes, and validation requirements.
Engineering note
Final specifications are selected according to target TDP, allowable junction temperature, ambient conditions, chassis height, and annual production volume.
| Parameter | Air-Cooled Server Heat Sinks | Liquid Cold Plates |
|---|---|---|
| Common materials | AL1060, AL6063, C1100 Copper | AL6061, AL6063, C1100 Copper |
| Fin types | Skived, zipper, extruded, folded | Internal micro-channels, CNC grooves |
| Fin thickness | 0.05 mm–2.0 mm | N/A |
| Fin density | Up to 40+ fins per inch with skiving | N/A |
| Processing | CNC, skiving, soldering, stamping | Vacuum brazing, FSW, CNC machining |
| Surface finish | Nickel plating, anodizing, passivation | Hard anodizing, chromate conversion |
| Testing | Thermal resistance, dimensional | Leakage at 10+ bar, pressure, flow rate |
Production readiness
From prototype to volume production
Speed to market matters in the server industry. Our production system is structured to validate performance quickly and scale without losing process control.
01 / Prototype
Rapid thermal validation
CNC machining and skiving produce functional prototypes for wind tunnel or server rack testing before hard tooling is approved.
02 / Scale
Volume manufacturing
Dedicated production lines support monthly capacity of 200,000 aluminum heat sinks and 30,000 liquid cold plates.
03 / Verify
Reliability and quality checks
CMM dimensional inspection, thermal resistance testing, and high-pressure leakage testing help verify components designed for 24/7 operation.
Request a technical evaluation
Start your server heat sink RFQ
Share your thermal and mechanical requirements with our engineering team. We will review your data and provide a manufacturability assessment focused on reliable performance and cost-effective production.
2D or 3D CAD files: SolidWorks, Creo, or AutoCAD preferred.
Thermal requirements: Target TDP, maximum allowable junction temperature, and ambient air temperature.
Space constraints: Height such as 1U or 2U, plus footprint dimensions.
Estimated volume: Prototype quantities and annual production targets.
Have a high-power server cooling challenge?
Talk with HeatsinkMaker about your next air-cooled or liquid-cooled platform.