Custom BGA Heat Sinks for High-Power Electronics
At HeatsinkMaker, we manufacture custom BGA (Ball Grid Array) heat sinks designed to solve the thermal bottlenecks of modern high-density integrated circuits. Whether you are cooling FPGAs, GPUs, CPUs, or high-power ASICs, we provide the engineering expertise and manufacturing precision to turn your thermal requirements into reliable, production-ready hardware.
Since 2014, we have partnered with OEMs and engineering teams worldwide to deliver cooling solutions that exceed the limitations of off-the-shelf components.
Engineered for High-Density IC Cooling
Standard BGA heat sinks often fall short when dealing with increased power densities and constrained PCB real estate. We specialize in custom-engineered solutions that maximize surface area and optimize airflow for your specific application.
Skived Fin BGA Heat Sinks
Ideal for high-power ICs. We form fins directly from a solid copper or aluminum block, allowing for ultra-thin fins and high density without the thermal resistance of a bonded interface.
Aluminum Extrusions
A cost-effective solution for standard BGA cooling requirements, with custom secondary CNC machining for precise mounting and fit.
Cold Forged Pin Fins
Perfect for applications with multi-directional or low-velocity airflow. Cold forging allows for high-aspect-ratio pin fins integrated into a single base.
CNC Machined Heat Sinks
For complex geometries, tight tolerances, and rapid prototyping where performance cannot be compromised.
Heat Pipe Integration
For extreme heat flux, we can embed copper heat pipes into the BGA sink base to spread heat rapidly across a larger fin array.
Need a custom process?
Unlike suppliers limited to a single production method, we select the best process based on your thermal load, space, and volume requirements.
Contact an engineer to discuss your requirements →Technical Capabilities
We maintain strict manufacturing tolerances and material specifications to meet your performance requirements.
| Capability | Specification |
|---|---|
| Materials | Aluminum 6061/6063/1060, Copper C1100 (Cu1100) |
| Fin Types | Straight fin, Pin fin, Skived fin, Folded fin |
| Fin Thickness | Down to 0.05mm (Skived) |
| Surface Finishing | Anodizing (Black/Clear), Nickel Plating, Passivation, Sandblasting |
| Attachment Methods | Thermal Tape, Push Pins, Wire Clips, Solder Anchors, Bolted |
| Design Software | AutoCAD, SolidWorks, Creo |
Why Partner with HeatsinkMaker?
Engineering Before Manufacturing
A BGA heat sink is more than just a piece of metal. Its effectiveness depends on the relationship between the heat source size, airflow, and fin geometry. Our team provides DFM (Design for Manufacturing) reviews and thermal simulation support to ensure your design is optimized for both performance and cost before production begins.
Prototype to Mass Production
We support your entire product lifecycle. We can deliver high-precision prototypes for thermal validation and quickly scale to high-volume production (up to 200,000+ units per month) while maintaining strict quality control.
Material Versatility
Whether you need the lightweight properties of Aluminum 6063 or the superior thermal conductivity of pure Copper C1100, we have the material supply chain and processing expertise to meet your specifications.
Industries We Serve
Our custom BGA cooling solutions are found in demanding environments across multiple industries.
Telecommunications & 5G
High-speed switching and base station hardware
AI & Data Centers
High-performance computing and server GPUs
Industrial Automation
Motor controllers and PLC processing units
Medical Equipment
Imaging systems and diagnostic hardware
Renewable Energy
Solar inverters and power conversion modules
Get a Custom RFQ for Your BGA Heat Sink
We make the transition from thermal design to physical product seamless. To receive a technical evaluation and quote, please provide the following information with your request.
- 1 2D/3D Drawings (Step, Dwg, or DXF)
- 2 Heat Load (Watts) and Max Allowable Component Temperature
- 3 Available Space and Airflow Conditions (CFM/LFM)
- 4 Target Volume (Prototype or Mass Production)
Contact our engineering team today to start your thermal project.
Get Your Free Quote NowHeatsinkMaker
Custom Thermal Solutions. Built for Production.