Folded Heat Sink Manufacturer for High-Power Electronics
HeatsinkMaker designs and manufactures custom folded heat sinks, including stamped and folded fin assemblies, for engineering-driven OEMs. From thermal design and prototyping to mass production, we match fin geometry, materials, joining methods, and manufacturing processes to your thermal targets, mechanical constraints, and cost objectives.
2014
Founded in China
Prototype to mass production
One coordinated supply chain
Global OEM support
Power, EV, telecom, computing, and more
Built around
Thermal targets
Engineered for
Production readiness
Technology overview
What is a folded heat sink?
A folded heat sink uses thin sheet metal fins that are stamped and folded to create high surface area and fin density. The folded fin stack is joined to an aluminum or copper base using soldering, brazing, or bonded-fin methods.
This construction is ideal when more surface area is needed than a traditional extrusion can provide, while a fully monolithic skived or cold-forged structure is not required.
01
High fin density
Thin-gauge fins increase surface area for efficient forced-convection cooling.
02
Flexible geometry
Straight, louvered, and corrugated patterns balance pressure drop and performance.
03
Scalable production
Repeatable stamped geometry supports prototypes through mid-to-high-volume production.
04
System integration
Heat pipes, vapor chambers, and custom footprints can be integrated around the heat source.
Manufacturing capability
A folded fin assembly configured around your application
Our team combines fin fabrication, precision bases, joining, surface finishing, and thermal integration under one supply chain. The result is a production-ready assembly matched to performance, volume, and cost.
Fin fabrication
Stamped and folded aluminum or copper fins with application-specific pitch, height, and pattern.
Base options
CNC-machined aluminum or copper bases and heat spreader plates designed for flatness and mounting needs.
Joining methods
Brazed, soldered, or bonded fin assemblies selected for thermal interface, reliability, and application fit.
Hybrid integration
Heat pipes, vapor chambers, skived, extruded, pinned, and wide-format FSW sections can be combined when needed.
Engineering support and DFM
Design the thermal path before production begins
A high-performance folded heat sink depends on the interaction of heat load, fin geometry, air velocity, pressure drop, and assembly method. We review the complete application so your design is manufacturable and testable.
Supported design tools
AutoCAD, SolidWorks, and Creo. Send a drawing or basic thermal and application data for an engineering review.
-
01
Thermal solution development
Structure design, thermal resistance evaluation, airflow review, and pressure-drop assessment.
-
02
Material and process selection
Balance aluminum or copper conductivity, mass, corrosion resistance, cost, and joining requirements.
-
03
Prototype optimization
CNC bases, fin stacks, joining trials, thermal validation, and iterative product refinement.
-
04
05
Dimensional, CMM, and quality inspection support for volume-ready designs.
Material and finish options
Select the right balance of conductivity, mass, and cost
Material and finish recommendations are application-driven and reviewed with our engineers.
Aluminum
1060 · 6061 · 6063
Used for bases and fins where low mass, conductivity, corrosion resistance, and cost must be balanced.
Copper
C1100
Used for bases, fins, heat pipes, and high-conductivity modules where heat spreading is critical.
Available finishing processes
Anodizing, hard anodizing, nickel plating, passivation, sandblasting, polishing, and cleaning.
Choosing the right architecture
When should you choose a folded heat sink?
- Higher fin density than standard extrusions is required.
- Fin geometry must be optimized for forced air and controlled pressure drop.
- Repeatable, cost-effective fins are needed for mid-to-high volumes.
- Heat pipes, large-format bases, or tailored heights and widths must be integrated.
Alternatives we also manufacture
Skived fins
Monolithic fins and very high fin density.
Cold-forged pins
Omnidirectional airflow applications.
Aluminum extrusions
Cost-effective profiles and robust structures.
Liquid cold plates
When air cooling is no longer sufficient.
Prototype to production
A controlled process for repeatable thermal hardware
01
Requirements intake
Heat load, temperature limits, ambient, airflow, space, and annual volume.
02
Co-design and DFM
Fin geometry, base type, joining method, and finish.
03
Prototyping
CNC bases, fin stacks, joining trials, and thermal validation.
04
Pilot run
Capability, repeatability, cosmetic, and dimensional checks.
05
Mass production
Stable cycle times, yield control, and a full inspection plan.
Testing and production
Built for inspection, integration, and scale
Production support includes CNC machining centers, stamping presses, soldering and brazing lines, skiving machines, FSW machines, ultrasonic cleaning, and assembly lines.
Thermal validation
Thermal performance testing and airflow or pressure-drop evaluation.
Dimensional control
Dimensional and CMM inspection for bases, mounting features, and assemblies.
Assembly quality
Surface, cosmetic, cleanliness, and contamination control.
Liquid module testing
Leakage and pressure testing for liquid-integrated modules.
Thermal roadmap
Integrate heat pipes today or transition to liquid cooling tomorrow
For concentrated or non-uniform heat sources, folded fin assemblies can incorporate heat pipes or vapor chambers to spread heat across a larger array. When airflow limits are reached, our team can evaluate vacuum-brazed, embedded-tube, or FSW liquid cold plates.
Heat pipe folded heat sinks
Embed or attach heat pipes to spread heat into large folded fin arrays.
Vapor chamber hybrids
Improve isothermality for demanding, uneven heat loads.
Liquid cold plates
Move to liquid cooling when available airflow cannot meet the thermal requirement.
Applications
Thermal hardware for demanding electronics
Since 2014, HeatsinkMaker has supported customers worldwide across power, transportation, communications, computing, medical, and industrial markets.
Power and energy
Power electronics, solar inverters, energy storage, and UPS.
Automotive and automation
EV power electronics, motor drives, and industrial automation.
Communications and computing
Telecom, 5G, servers, AI, and data center hardware.
Specialized electronics
Semiconductor, laser, medical, instrumentation, transportation, LED, and industrial lighting drivers.
Design review checklist
Key considerations for folded fins
Our engineers can simulate and iterate fin patterns to meet thermal resistance, airflow, pressure-drop, acoustic, and mechanical targets.
Fin geometry
Straight, louvered, or corrugated patterns for the target convection and pressure drop.
Fin pitch and height
Balance surface area with airflow channel openness.
Base and interface
Set base thickness, material, flatness, hole patterns, TIM selection, and mounting constraints.
Joining and finish
Use brazing or soldering for low thermal resistance, bonding where appropriate, and anodizing or nickel plating for application needs.
Airflow system
Ensure ducting, shrouds, and fan selection match the fin resistance.
Material selection
Choose aluminum or copper according to conductivity, mass, corrosion resistance, and cost.
Request an engineering evaluation
Send the information needed for a fast, practical quotation
Share your design package or basic requirements. We will recommend whether a folded heat sink, skived fin, extrusion, or liquid cooling solution best fits your performance, volume, and lifecycle cost objectives.
What to send for quotation
- 2D drawings and 3D CAD files
- Heat load and heat source locations
- Maximum component and ambient temperatures
- Airflow, velocity, or pressure-drop limits
- Envelope and mounting constraints
- Finish and coating requirements
- Annual volume and prototype timing
- Target cost
About HeatsinkMaker
Custom thermal solutions. Built for production.
Founded in 2014 in China, HeatsinkMaker manufactures custom heat sinks, thermal modules, and liquid cold plates for high-power electronics. By combining skiving, extrusion, stamping and folded fin, bonded fin, soldering and brazing, cold forging, CNC machining, friction stir welding, and vacuum brazing under one supply chain, we deliver the right thermal solution engineered for production.
Capabilities at a glance
Start your thermal project
Discuss your folded heat sink requirements with our team
Send drawings, CAD files, thermal targets, or application data for a practical manufacturing recommendation.