Custom Thermal Solutions
Semiconductor Cooling Module Manufacturing
HeatsinkMaker designs and manufactures custom semiconductor cooling modules for high-power electronics and semiconductor equipment. Since 2014, we have partnered with engineering-driven OEMs to turn thermal requirements and 2D/3D drawings into reliable, manufacturable cooling solutions—from prototype to mass production.
Our multi-process supply chain spans air and liquid cooling: high-density heat sinks, heat pipe assemblies, and liquid cold plates with vacuum brazed or friction stir welded structures. We support full lifecycle development with thermal and mechanical design, DFM review, prototyping, precision CNC machining, thermal testing and scalable production.
Engineering-Driven Thermal Development
A high-performing semiconductor cooling module is the result of engineering trade-offs across heat load, source size, airflow, thermal resistance, pressure drop, material, fin geometry, mounting, environment and cost. Our team supports you with:
- Thermal solution development and heat sink structure design
- Mechanical design and DFM/manufacturability review
- Material and manufacturing process selection
- Thermal simulation support
- Prototype development and product optimization
- Thermal resistance and liquid leakage testing
- Dimensional inspection, including CMM
We commonly work from AutoCAD, SolidWorks and Creo. Engage us with a drawing or with basic application data—heat load, maximum allowable temperature, ambient, available space and airflow—for an engineering evaluation.
Manufacturing Technologies for Semiconductor Cooling Modules
We combine multiple thermal manufacturing technologies under one supply chain, selecting the best-fit method based on thermal performance, geometry, volume and target cost.
Skived Fin Heat Sinks
Skived fins are formed directly from the base block (aluminum or copper) to eliminate fin-to-base thermal interfaces and unlock high fin density for compact air-cooled modules.
- Materials: AL1060, AL6063, Cu1100
- Fin thickness: 0.2–3.0 mm; gaps 0.2–10 mm
- Min fin thickness/gap: 0.05 mm (geometry dependent)
- Fin height: up to 140 mm (Al), 60 mm (Cu)
- Processing length: up to 3,500 mm
Best for high-power air-cooled modules where conventional extrusion cannot provide sufficient surface area.
Aluminum Extruded Heat Sinks and FSW Assemblies
We produce custom 6061/6063 extrusions and apply secondary CNC machining, drilling, tapping, deburring and anodizing.
- High-performance profiles: fin aspect ratios above 20:1
- Ultra-wide FSW assemblies: up to ~762 mm width
- FSW capability: fin aspect ratios >40:1
Ideal for wide, high-aspect-ratio air-cooled modules and cost-effective volume production.
Cold Forged Heat Sinks
Cold forging creates integrated pin or straight fins with high aspect ratios and good thermal conduction.
- Materials: Aluminum 6063 and Copper C1100
- Fin aspect ratios: up to 35:1
- Geometries: round, oval, straight or mixed fins
- Secondary: CNC machining, drilling, tapping, finishing
Suitable for compact, high-density pin-fin modules for power electronics and control equipment.
Heat Pipe Integrated Modules
Heat pipe assemblies spread concentrated heat from small heat sources to larger fin surfaces, improving temperature uniformity.
- Integration: copper heat pipes with stamped/zipper fins, CNC bases
- Joining: soldering and brazing, optional nickel plating
- Typical: Ø8 mm heat pipes, custom quantity and geometry
Useful for hot-spot mitigation and orientation-agnostic heat spreading in air-cooled modules.
Liquid Cold Plates
When air cooling is not sufficient, we manufacture custom liquid cold plates and liquid-cooled thermal assemblies.
- • Vacuum brazed aluminum cold plates
- • Friction stir welded plates and extrusions
- • Embedded-tube, exposed-tube, half/full/sandwiched buried tube architectures
- • CNC-machined flow channels and custom microchannel structures
- • Operating pressure design for >10 bar, application dependent
Typical use cases include IGBT/SiC power modules, inverter stacks, high-power RF, laser drivers and semiconductor equipment where liquid loops are available.
Design Ranges and Material Options
- Materials:Aluminum 1060/6061/6063; Copper C1100
- Precision machining:±0.002–±0.008 mm capability
- Surface finishes:Anodizing, hard anodizing, nickel plating, passivation, sandblasting, polishing, cleaning
- Processes:Skiving, extrusion, CNC machining, stamping, soldering, brazing, bonded fin, cold forging, friction stir welding
We balance performance, manufacturability and cost through process selection and DFM.
Typical Module Architectures
Air-cooled heat sink modules
- • Skived fin or extruded heat sinks with high fin density
- • Heat pipe-assisted spreaders for hot-spot control
- • Large-format FSW assemblies for ultra-wide profiles
Liquid-cooled cold plate modules
- • Vacuum brazed microchannel cold plates for high heat flux
- • Embedded-tube or exposed-tube cold plates for robust designs
- • FSW plates with CNC-machined channels for large-area interfaces
Hybrid modules
- • Cold plates combined with bonded/skived fin sections
- • Modular assemblies integrating heat pipes, fin stacks and machined bases
Performance Testing and Inspection
- Liquid cold plate leakage and pressure testing
- Thermal performance testing under defined flow and heat load
- Flow-channel and surface inspection
- Dimensional inspection and CMM
- Clean, consistent finishing and ultrasonic cleaning where applicable
Production Readiness and Capacity
Development Model: Prototype → Validation → Pilot Run → Mass Production
CNC machining centers: 50 sets; stamping 30T–200T; skiving machines; friction stir welding machines.
Aluminum heat sinks
200,000 pcs/month
Soldered Al/Cu heat sinks
150,000 pcs/month
Liquid cold plates
30,000 pcs/month
Skived fin heat sinks
50,000 pcs/month
Precision machined parts
300,000 pcs/month
Applications in Semiconductor and High-Power Electronics
Why HeatsinkMaker for Semiconductor Cooling Modules
Engineering Before Manufacturing
Thermal and mechanical design with DFM and process selection.
Multi-Process Supply Chain
Skiving, extrusion, cold forging, brazing, soldering, FSW and CNC under one roof.
Prototype-to-Production Scalability
Consistent quality from early samples to volume builds.
Performance and Reliability
Thermal, pressure and leakage testing; dimensional verification.
How to Start Your Project
Send us the essentials for a quick, informed proposal:
- 2D drawings and/or 3D CAD files
- Heat load and heat source dimensions
- Maximum allowable component temperature and ambient conditions
- Airflow or coolant type, flow rate and pressure limits (if applicable)
- Available installation space and mounting constraints
- Target annual volume and delivery expectations
We will evaluate your application and recommend an appropriate semiconductor cooling module—air-cooled, heat pipe-assisted or liquid-cooled—optimized for performance, manufacturability and production cost.
HeatsinkMaker — Custom Thermal Solutions. Built for Production.